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We supply circuit boards or processor modules in accordance with your
wishes in a material thickness of between 0.4 and 6.0 millimetres and
up to a size of 610 x 530 millimetres. Our partners are based in the Far
East.
- Double-sided printed circuits
- Multilayer up to 20 layers
- Plug-in printed circuits
- Printed circuits with controlled impedance
- Laser drilled circuit boards
- Minimum lines and spaces 50µ
- Buried Vias
- Blind Vias
- Printed circuits for BGAs (Ball Grade Array)
- Available in conformance with RoHS since January 2005
- HDI-circuits
| Base material |
FR 4 and FR 5 |
| Surfaces |
HAL,
Chem. Nickel/gold (Ni/Au),
Chem. Tin, plug gold, carbon |
| Additional printing |
strippable coating, markings printing, via-hole filler |
| Solder resist |
photosensitive coatings |
Quality assurance:
- ISO 9002 certified
- UL certified
- Inspection of the components with AOI devices (optical
inspection)
- Electronic inspection single-sided/double-sided
- Protocol manufacture (SPC)
- Incoming inspection in our company
Delivery periods:
- Production series 15 to 20 working days
- Large-scale production series 15 to 20 working days
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We can provide boards up to 530 x 610 mm in dimensions.
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